- solder down
- остепеняться
глагол:
остепеняться (settle down, solder Down, settle, come to an anchor, steady)
Англо-русский синонимический словарь. 2014.
solder down
Смотреть что такое "solder down" в других словарях:
Solder paste — (or solder cream) is used for connecting the terminations of the IC packages with that of land patterns on the PCB. The paste is applied to the lands by printing the solder using a stencil, while other methods like screening and dispensing are… … Wikipedia
Solder — A solder is a fusible metal alloy with a melting point or melting range of 90 to 450 °C (200 to 840 °F), used in a process called soldering where it is melted to join metallic surfaces. It is especially useful in electronics and plumbing. Alloys… … Wikipedia
Microelectromechanical system oscillator — Microelectromechanical system (MEMS) oscillators are timing devices that generate highly stable reference frequencies. These reference frequencies are used to sequence electronic systems, manage data transfer, define radio frequencies, and… … Wikipedia
Soldering — For the song, see Soldering (song). For the product, see Solder. Desoldering a contact from a wire. Soldering is a process in which two or more metal items are joined together by melting and flowing a filler metal (solder) into the joint, the… … Wikipedia
Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… … Wikipedia
Reflow soldering — is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily hold the components to their attachment pads, after which the assembly is carefully heated in order to solder the joint. The assembly may… … Wikipedia
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
Lead poisoning — Classification and external resources An X ray demonstrating the characteristic finding of lead poisoning, dense metaphyseal lines. ICD 10 T … Wikipedia
Soldering iron — Infobox tool name = Soldering iron caption =A gas fired soldering iron other name =Soldering Gun classification = Metal joining types = related = Brazing WeldingA soldering iron is a device for applying heat to melt solder for attaching two metal … Wikipedia
Automated optical inspection — (AOI) is an automated visual inspection of a wide range of products, such as printed circuit boards (PCBs), LCDs, transistors, automotive parts, lids and labels on product packages or agricultural products (seed corn or fruits). In case of PCB… … Wikipedia
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
